Fabrication in MNF

The Micro Nanofabrication Facility (MNF) manages the laboratories and facilities of common interest for all the units of the Center. Specifically, MNF runs three fabrication cleanrooms, dedicated to silicon based radiation detectors and integrated photonics, to MEMS and NEMS and to the 3D integration platform.

CRD – silicon detectors cleanroom

Cleanroom dedicated to silicon based radiation sensors and integrated photonics. The cleanroom is in class 100. The lithography bay is in class 10. Minimum feature size 3um (double side mask aligner), 350nm (stepper), 10nm (EBL). Being dedicated to radiation sensors, metals are limited to aluminum and titanium.

CRM – MEMS and NEMS cleanroom

Cleanroom dedicated MEMS and NEMS. The cleanroom is in class 1000. The lithography bay is in class 100. Minimum feature size 1um (mask aligner). Nanofabrication oriented dual beam system (feature sizes 20nm).

CR3D – 3D integration cleanroom

Clean room dedicated to 3D integration technology. The lab is divided into two areas focused on the grinding and bonding/debonding processes respectively. The lab is compatible with 6-8 inch processes.

MORE INFO ARE AVAILABLE AT THIS LINK

The following is a list of the standard fabrication processes commonly used in the MNF Cleanrooms. Any Process included in the list can be requested and executed without additional approval.

• Full Silicon processing 150 mm Wafers down to 0.5 µm Linewidth (Stepper)
• Full Silicon processing 150 mm Wafers down to 2.5 µm Linewidth (Mask-aligner)
• Doubleside Processing (preliminary Process Flow Check requested)
• Bulk & Surface Micromachining (MEMS)
• Deep trenches and TSV with a Adixen ASM DRIE
• Thin film deposition with controlled mechanical features with a STS PECVD.
• Submicron lithography with a Nikon stepper
• TMAH bulk micromachining
• Thick film electroplating – Au, Cu, Ag
• Dry film processing
• Stencil Screen printing
• Thermocompression bonding on various substrate type & size
• AuSn Eutectic bonding
• Lift-off Process
• Galvanic Gold Deposition
• Large Area Radiation Detectors
• Wafer Level Bonding
• Standard Substrates: Si & Quartz wafers, 150 mm, 250 – 675 um thick, primary flat only.

If you are interested in a process that falls outside the list, please contact us and we will try and accommodate your request, if possible. For any inquiry about the micro & nanofabrication services please contact Lorenza Ferrario.