Cleanrooms

CRD – silicon detectors cleanroom

The silicon detectors cleanroom extends over 500 sqm, and is classified ISO 4-5. It is equipped with a double-side mask aligner and a stepper granting a minimum line widht of 500 nm.
It processes 150mm wafers and it is mainly dedicated to radiation sensors and integrated photonics.
To maintain the yield and quality standards achieved it follows strict rules and requirements in terms of contamination (wafer exchange with other laboratories, materials and processes allowed).

Main processes and tools available in the laboratory:

Lithography

• • • Photolithography – Mask aligner: EVG 6200NT
    • Photolithography – Stepper: Nikon NSR2205i11D
    • Ebeam lithography – EBL: Tescan NISABA
    • Ebeam lithography – SEM ebeam tool VEGA

Etching

• • • Metal etcher: Oxford PlasmaPro100 Cobra300
    • Asher: Oxford PlasmaPro100 Cobra65
    • Dielectrics etchers: Oxford PlasmaPro100 Cobra300
    • DRIE Bosch etching – DRIE: Alcatel AMS200
    • Dry ashing – Plasma: Tepla Asher 300 AutoLoad
    • Wet benches

Thermal processing

• • • Silicon dry oxidation – Furnace Centrotherm E1200HT
    • Silicon wet oxidation – Furnace Centrotherm E1200HT
    • Drive in – Furnace Centrotherm E1200HT
    • Sintering – Furnace – Furnace Centrotherm E1200HT
    • Annealing – RTA/RTP: Jipelec JetFirst 200C

Synthesis

• • • Spin coating – Spin coater:  EVG 120
    • Spin coating – Spin coater: POLOS sps 150i npp
    • Spin coating – Tracker: SVG 8600
    • Chemical Vapour Deposition – LPCVD: Furnace Centrotherm E1200HT for Poly Silicon
    • Chemical Vapour Deposition – LPCVD: Furnace Centrotherm E1200HT for TEOS
    • Chemical Vapour Deposition – LPCVD: Furnace Centrotherm E1200HT for Silicon Nitride
    • Chemical Vapour Deposition – PECVD: STS MULTIPLEX CVD
    • Chemical Vapour Deposition – ICP-CVD: Oxford PlasmaPro100
    • Physical Vapour Deposition – Sputter: Eclipse MCR

Doping

• • • Ion Implantation – App. Material Varian E220

Characterization

• • • SEM – TESCAN VG12711473 Vega3 XMH
    • Ellipsometer – JobinIvon UVISEL NIR AGAS
    • Lifetime tester – Sinton WCT 120
    • Semi-automatic microscope – Keyence VHX-X1
    • Interferometers – Leitz MPV SP
    • Manual microscopes

CRM – MEMS and NEMS cleanroom

The MEMS and NEMS cleanroom extends over 100 sqm, and is classified ISO 5-6 class. It is equipped with a single-side mask aligner with a minimum line width of 2.5 μm. It is a general purpose cleanroom facility with higher flexibility in terms of materials.

Main processes and tools available in the laboratory:

Lithography

• • • Photolithography – Mask Aligner: Karl Suss MA6 BA6
    • Photolithography – Direct Laser Writer: Heidelberg DWL66+
    • Focused ion-beam lithography: FIB-SEM – Raith Velion

Etching

• • • Dry Etcher – Tegal/ACS 903
    • HF Vapour Etcher – SPTS Tech. Primaxx
    • Asher – Matrix S.One Model10X
    • Wet benches

Thermal processing

• • • Silicon dry oxidation – Furnace: Expertec CTR-200
    • Silicon wet oxidation – Furnace: Expertec CTR-200
    • Sintering – Furnace: Expertec CTR-200
    • Annealing – RTA/RTP: Jipelec JetFirst 200C
    • Baking – Oven: Heraues Rein Raum T5028
    • Baking – Oven: Mazzali F.lli Thermotest

Synthesis

• • • Spin coating – Tracker: SVG 8600
    • Spin coating – Spin coater: APT GmbH SPIN150
    • Spin coating – Spin coater: Laurell WS 650SZ
    • Dry Film Laminator – Laminator: Bungard Elek
    • Physical Vapour Deposition – Sputter: Kenosystec KS 800 C Cluster
    • Physical Vapour Deposition – Evaporator: ULVAC EBX-16C
    • Electroplating: RENA EPM100

Bonding

• • • Bonding – Wafer Bonder: AML AWB04

Characterization

• • • AFM: Nt-Mdt PX
    • Interferometer: Leitz MPV SP
    • Resistivity Probe: Napson CRESBOX
    • Optical profilometer: Zygo NewView6300
    • Profilometer: KLA Tencor P15
    • Optical microscopes

CRP – packaging and integration cleanroom

The packaging and integration cleanroom extends over 60 sqm, and is classified ISO 6 class.
It is equipped with precision manual pick& place and bonder for prototype assembly.

Main processes and tools available in the laboratory:

• • • Ball wire bonding – Wire Bonder – TPT HB16
    • Ball wire bonding – Wire Bonder – K&S 4124
    • Pull&Shear test XYZTest CondorEz
    • Micro-assembly Tresky T3000
    • Stencil/Screen Printer – Aurel VS1520A
    • Plasma Chamber Diener Elec. Zepto
    • Oven ATV SRO700 Table
    • Oven Atm Memmert UNP 400
    • Wet Benches
    • Optical microscopes

CR3D – 3D integration cleanroom

Main tools available in the laboratory:

Grinding processes

• • • Automatic Grinder – Disco DAG810
    • CMP – G&P Technology Poli-500 
    • Automatic Dicing Saw – Disco DAD3350
    • Dhelaminator – Disco 200/D
    • Aut. Cleaning System – Disco DCS1440

Bonding processes

• • • Coater/Cleaner – EVG 101
    • Bake systems – EVG 105
    • Wafer Bonder – EVG 520 IS
    • Debonder – EVG 805DB 
    • Oven – MSL VX200HA
    • ALD – Beneq Oi TFS 200

Cleaning

• • • Cleaner – Osiris CMP30CHEMIXX
    • Wet bench

Characterization

• • • FTR GmbH MicroProf300
    • Optical microscopes

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