Back-end

The back-end area includes the Integration & Packaging Lab and the Functional Test Lab.

The Integration & Packaging Lab focuses on the assembly, interconnection, and packaging of micro- and nanofabricated devices, enabling the transition from fabrication to functional prototypes.

The Functional Test Lab hosts multiple test-benches for microchip electrical characterization, PCB assembly and testing, and includes a climatic chamber for temperature-dependent measurements. A dedicated setup supports the characterization of Terahertz detectors up to 1.1 THz.

MORE INFO ARE AVAILABLE AT THIS LINK

If you are interested in a process that falls outside the list, please contact us and we will try and accommodate your request, if possible. For any inquiry about the micro & nanofabrication services please contact Lorenza Ferrario.