Cleanrooms

CRD – silicon detectors cleanroom

The silicon detectors cleanroom extends over 500 sqm, and is classified ISO 4-5. It is equipped with a double-side mask aligner and a stepper granting a minimum line widht of 500 nm.
It processes 150mm wafers and it is mainly dedicated to radiation sensors and integrated photonics.
To maintain the yield and quality standards achieved it follows strict rules and requirements in terms of contamination (wafer exchange with other laboratories, materials and processes allowed).

Main tools available in the laboratory:

Lithographic processes

• • • Coater/developer – EVG 120
    • Coater/developer – SVG 8600
    • Coater – POLOS sps 150i npp
    • Mask aligner – EVG 6200NT
    • Stepper – Nikon NSR2205i11D
    • EBL – Tescan NISABA

Etching processes

• • • Metal etcher – Oxford PlasmaPro100 Cobra300
    • Asher – Oxford PlasmaPro100 Cobra65
    • Dielectrics etchers – Oxford PlasmaPro100 Cobra300
    • DRIE – Alcatel AMS200
    • Asher – Tepla Asher 300 AutoLoad
    • Wet benches

Thermal processes

• • • Furnaces for thermal oxide – Centrotherm E1200HT
    • Furnace for sintering – Centrotherm E1200HT
    • Furnace for LPCVD SiN – Centrotherm E1200HT
    • Furnace for LPCVD TEOS – Centrotherm E1200HT
    • RTA/RTP – Jipelec JetFirst 200C

Deposition processes

• • • PECVD – STS MULTIPLEX CVD
    • ICP-CVD – Oxford PlasmaPro100
    • PVD – Eclipse MCR

Ion implantation processes

• • • Ion Implanter – App. Material Varian E220

Characterization

• • • SEM – TESCAN VG12711473 Vega3 XMH
    • Ellipsometer – JobinIvon UVISEL NIR AGAS
    • Lifetime tester – Sinton WCT 120
    • Semi-automatic microscope – Keyence VHX-X1
    • Interferometers – Leitz MPV SP
    • Manual microscopes

CRM – MEMS and NEMS cleanroom

The MEMS and NEMS cleanroom extends over 100 sqm, and is classified ISO 5-6 class. It is equipped with a single-side mask aligner with a minimum line width of 2.5 μm. It is a general purpose cleanroom facility with higher flexibility in terms of materials.

Main tools available in the laboratory:

Lithographic processes

• • • Coater/developer – SVG 8600
    • Coater – Laurell WS 650SZ
    • Coater – APT GmbH SPIN150
    • Mask Aligner – Karl Suss MA6 BA6
    • Direct Laser Writer – Heidelberg DWL66+
    • Dry Film Laminator – Bungard Elek

Etching processes

• • • Dry Etcher – Tegal/ACS 903
    • Metal etcher – Oxford PlasmaPro100 Cobra300
    • HF Vapour Etcher – SPTS Tech. Primaxx
    • Asher – Matrix S.One Model10X
    • Wet benches

Thermal processes

• • • Furnace – Expertec CTR-200
    • RTA/RTP – Jipelec JetFirst 200C
    • Oven – Heraues Rein Raum T5028
    • Oven – Mazzali F.lli Thermotest

Deposition processes

• • • PVD Sputter – Kenosystec KS 800 C Cluster
    • PVD Evaporator – ULVAC EBX-16C

Nanofabrication processes

• • • FIB-SEM – Raith Velion

Other processes

• • • Wafer Bonder AML AWB04
    • Electro Plater RENA EPM100

Characterization

• • • AFM – Nt-Mdt PX
    • Interferometer – Leitz MPV SP
    • Resistivity Probe – Napson CRESBOX
    • Optical profilometer – Zygo NewView6300
    • Profilometer – KLA Tencor P15
    • Optical microscopes

CRP – packaging and integration cleanroom

The packaging and integration cleanroom extends over 60 sqm, and is classified ISO 6 class.
It is equipped with precision manual pick& place and bonder for prototype assembly.

Main tools available in the laboratory:

• • • Wire Bonder TPT HB16
    • Wire Bonder K&S 4124
    • Pull&Shear test XYZTest CondorEz
    • Micro-assembly Tresky T3000
    • Stencil/Screen Printer – Aurel VS1520A
    • Plasma Chamber Diener Elec. Zepto
    • Oven ATV SRO700 Table
    • Oven Atm Memmert UNP 400
    • Wet Benches
    • Optical microscopes

CR3D – 3D integration cleanroom

Main tools available in the laboratory:

Grinding processes

• • • Automatic Grinder – Disco DAG810
    • CMP – G&P Technology Poli-500 
    • Automatic Dicing Saw – Disco DAD3350
    • Dhelaminator – Disco 200/D
    • Aut. Cleaning System – Disco DCS1440

Bonding processes

• • • Coater/Cleaner – EVG 101
    • Bake systems – EVG 105
    • Wafer Bonder – EVG 520 IS
    • Debonder – EVG 805DB 
    • Oven – MSL VX200HA
    • ALD – Beneq Oi TFS 200

Cleaning

• • • Cleaner – Osiris CMP30CHEMIXX
    • Wet bench

Characterization

• • • FTR GmbH MicroProf300
    • Optical microscopes

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