IPCEI ME
The IPCEI on Microelectronics/IPCEI ME, started in 2018, brings together many important microelectronics topics: e.g. optics development, hardware design, process knowledge, production facilities, chip manufacture. More than European 40 companies and RTOs will cooperate with up to 425 additional partners on 5 technology fields: energy efficient chips, power semiconductors, sensors, advanced optical equipment and compound materials.
FBK project in this IPCEI is on development 3D integration technology (sensor + readout chip, or sensor+sensor) to develop more efficient, small and low power consumption systems, with first demo on custom SiPM+CMOS.
Main achievements:
- Fabrication, measurement, and analysis of the Front-End-of-Line of the first prototype the SiPM backside illuminated for NUV and VUV light detection.
- Functional measurements and analysis of the new improved prototypes of NIR Backside illuminated SiPM for Lidar.
- Fabrication of the Back-end-of-line of the first prototype of the SiPM with TSV Via-Mid, measurements and analysis.
- Fine tuning of the TSV processing Via-Last and Via-Mid.
- Preliminary test of 3D integration technologies such as bump bonding.
Duration: 2018-2024
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Closing event of the IPCEI ME - The Bruno Kessler Foundation (FBK) has played a pivotal role in advancing micro-nanoelectronic technologies, bridging research excellence with industrial innovation. From the Open Facility model to large-scale initiatives like IPCEI and the European Chips Act, FBK has fostered collaboration and technological progress in the semiconductor sector. The closing event of the IPCEI ME@FBK project marks a key milestone, celebrating achievements and paving the way for future developments in European microelectronics.More info
