CRD \u2013 silicon detectors cleanroom<\/span><\/h2>\nThe silicon detectors cleanroom extends over 700 sqm, and is classified ISO 4-5. It is equipped with a double-side mask aligner and a stepper granting a minimum line widht of 500 nm.
\nIt processes 150mm wafers and it is mainly dedicated to radiation sensors and integrated photonics.
\nTo maintain the yield and quality standards achieved it follows strict rules and requirements in terms of contamination (wafer exchange with other laboratories, materials and processes allowed).<\/p>\n
<\/p>\n
Main processes and tools available in the laboratory:<\/strong><\/span><\/p>\nLithography<\/span><\/span><\/p>\n\n- \n
\n- \n
\n- Photolithography – Mask aligner: EVG 6200NT<\/span><\/li>\n
- Photolithography – Stepper: Nikon NSR2205i11D<\/span><\/li>\n
- Ebeam lithography – EBL: Tescan NISABA (installed in 2024)<\/em><\/span><\/li>\n
- Ebeam lithography – SEM ebeam tool VEGA<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
Etching<\/span><\/p>\n\n- \n
\n- \n
\n- Metal etcher: Oxford PlasmaPro100 Cobra300<\/span><\/li>\n
- Asher: Oxford PlasmaPro100 Cobra65<\/span><\/li>\n
- Dielectrics etchers: Oxford PlasmaPro100 Cobra300 (installed in 2025)<\/em><\/span><\/li>\n
- Dielectrics etchers: Oxford PlasmaPro100 Cobra300<\/span><\/li>\n
- DRIE Bosch etching – DRIE: Alcatel AMS200<\/span><\/li>\n
- Dry ashing – Plasma: Tepla Asher 300 AutoLoad<\/span><\/li>\n
- Wet benches<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
Thermal processing<\/span><\/p>\n\n- \n
\n- \n
\n- Silicon dry oxidation – Furnace Centrotherm E1200HT<\/span><\/li>\n
- Silicon wet oxidation – Furnace Centrotherm E1200HT<\/span><\/li>\n
- Drive in – Furnace Centrotherm E1200HT<\/span><\/li>\n
- Sintering – Furnace – Furnace Centrotherm E1200HT<\/span><\/li>\n
- Annealing – RTA\/RTP: Jipelec JetFirst 200C<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
Synthesis<\/span><\/span><\/p>\n\n- \n
\n- \n
\n- Spin coating – Spin coater:\u00a0 EVG 120<\/span><\/li>\n
- Spin coating – Spin coater: POLOS sps 150i npp<\/span><\/li>\n
- Spin coating – Tracker: SVG 8600<\/span><\/li>\n
- Chemical Vapour Deposition – LPCVD: Furnace Centrotherm E1200HT for Poly Silicon<\/span><\/li>\n
- Chemical Vapour Deposition – LPCVD: Furnace Centrotherm E1200HT for TEOS<\/span><\/li>\n
- Chemical Vapour Deposition – LPCVD: Furnace Centrotherm E1200HT for Silicon Nitride<\/span><\/li>\n
- Chemical Vapour Deposition – PECVD: STS MULTIPLEX CVD<\/span><\/li>\n
- Chemical Vapour Deposition – ICP-CVD: Oxford PlasmaPro100<\/span><\/li>\n
- Physical Vapour Deposition – Sputter: Eclipse MCR<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
Doping<\/span><\/p>\n\n- \n
\n- \n
\n- Ion Implantation – App. Material Varian E220<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
Characterization<\/span><\/p>\n\n- \n
\n- \n
\n- SEM – TESCAN VG12711473 Vega3 XMH<\/span><\/li>\n
- Ellipsometer – JobinIvon UVISEL NIR AGAS<\/span><\/li>\n
- Lifetime tester – Sinton WCT 120<\/span><\/li>\n
- Semi-automatic microscope – Keyence VHX-X1<\/span><\/li>\n
- Interferometers – Leitz MPV SP<\/span><\/li>\n
- Manual microscopes<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
\nCRM \u2013 MEMS and NEMS cleanroom<\/span><\/h2>\nThe MEMS and NEMS cleanroom extends over 500 sqm, and is classified ISO 5-6 class. It is equipped with a single-side mask aligner with a minimum line width of 2.5 \u03bcm. It is a general purpose cleanroom facility with higher flexibility in terms of materials.<\/p>\n
<\/p>\n
Main processes and tools available in the laboratory:<\/strong><\/span><\/p>\nLithography<\/span><\/p>\n\n- \n
\n- \n
\n- Photolithography – Mask Aligner: Karl Suss MA6 BA6<\/span><\/li>\n
- Photolithography – Direct Laser Writer: Heidelberg DWL66+ (installed in 2024)<\/em><\/span><\/li>\n
- Focused ion-beam lithography: FIB-SEM – Raith Velion<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
Etching<\/span><\/p>\n\n- \n
\n- \n
\n- Dry Etcher – Tegal\/ACS 903<\/span><\/li>\n
- HF Vapour Etcher – SPTS Tech. Primaxx<\/span><\/li>\n
- Asher – Matrix S.One Model10X<\/span><\/li>\n
- Wet benches<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
Thermal processing<\/span><\/p>\n\n- \n
\n- \n
\n- Silicon dry oxidation – Furnace: Expertec CTR-200<\/span><\/li>\n
- Silicon wet oxidation – Furnace: Expertec CTR-200<\/span><\/li>\n
- Sintering – Furnace: Expertec CTR-200<\/span><\/li>\n
- Annealing – RTA\/RTP: Jipelec JetFirst 200C<\/span><\/li>\n
- Baking – Oven: Heraues Rein Raum T5028<\/span><\/li>\n
- Baking – Oven: Mazzali F.lli Thermotest<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
Synthesis<\/span><\/p>\n\n- \n
\n- \n
\n- Spin coating – Tracker: SVG 8600<\/span><\/li>\n
- Spin coating – Spin coater: APT GmbH SPIN150<\/span><\/li>\n
- Spin coating – Spin coater: Laurell WS 650SZ<\/span><\/li>\n
- Dry Film Laminator – Laminator: Bungard Elek<\/span><\/li>\n
- Physical Vapour Deposition – Sputter: Kenosystec KS 800 C Cluster<\/span><\/li>\n
- Physical Vapour Deposition – Evaporator: ULVAC EBX-16C<\/span><\/li>\n
- Electroplating: RENA EPM100<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
Bonding<\/span><\/p>\n\n- \n
\n- \n
\n- Bonding – Wafer Bonder: AML AWB04<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
Characterization<\/span><\/p>\n\n- \n
\n- \n
\n- AFM: Nt-Mdt PX<\/span><\/li>\n
- Interferometer: Leitz MPV SP<\/span><\/li>\n
- Resistivity Probe: Napson CRESBOX<\/span><\/li>\n
- Optical profilometer: Zygo NewView6300<\/span><\/li>\n
- Profilometer: KLA Tencor P15<\/span><\/li>\n
- Optical microscopes<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
\nCRP \u2013 packaging and integration cleanroom<\/span><\/h2>\nThe packaging and integration cleanroom extends over 60 sqm, and is classified ISO 6 class.
\nIt is equipped with precision manual pick& place and bonder for prototype assembly.<\/p>\n
<\/p>\n
Main processes and tools available in the laboratory:<\/strong><\/span><\/p>\n\n- \n
\n- \n
\n- Ball wire bonding – Wire Bonder – TPT HB16\u00a0<\/span><\/li>\n
- Ball wire bonding – Wire Bonder – TPT HB16 Pass Through (installed in 2025)<\/span><\/li>\n
- Ball wire bonding – Wire Bonder – K&S 4124<\/span><\/li>\n
- Pull&Shear test XYZTest CondorEz<\/span><\/li>\n
- Micro-assembly Tresky T3000<\/span><\/li>\n
- Stencil\/Screen Printer – Aurel VS1520A<\/span><\/li>\n
- Plasma Chamber Diener Elec. Zepto<\/span><\/li>\n
- 3D Printer Creatbot F430 (installed in 2024)<\/span><\/li>\n
- Oven ATV SRO700 Table<\/span><\/li>\n
- Oven Atm Memmert UNP 400<\/span><\/li>\n
- Wet Benches<\/span><\/li>\n
- Optical microscopes<\/span><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n
\nCR3D – 3D integration cleanroom<\/span><\/h2>\nThe 3D integration cleanroom extends over 180 sqm, and is classified ISO 4\/5 class.<\/p>\n
It is equipped with the complete line of systems which allow the processing of Back-side illuminated sensors and vertical integration, Wafer<\/p>\n
bonding (permanent metal, temporary) and debonding, TSV interconnections and Wafer grinding and polishing.<\/p>\n
<\/p>\n
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